Osaka Prefecture University

Internal and Interfacial Structures of a Material, Key Elements of Dissimilar Materials Bonding, Uncovered by Non-Destructive Examination: Applying Three-dimensional X-ray Imaging to an Epoxy Monolith Material

LastUpDate: September 26, 2020

A research group, consisting of Professor Akikazu Matsumoto, Assistant Professor Yasuhito Suzuki, and Ms. Nanako Sakata as the second-year master’s student at the Graduate School of Engineering of Osaka Prefecture University, has succeeded in direct observation of the internal and interfacial structures of a dissimilar materials bonding system, prepared by thermal welding of thermoplastics to a porous epoxy monolith layer on a glass or metal plate. This was achieved by utilizing the technique of three-dimensional X-ray imaging, a non-destructive analysis, in joint research with Dr. Yoshihiro Takeda at the X-ray Research Laboratory of Rigaku Corporation and Dr. Masaru Kotera at the Hot Melt Division of MORESCO Corporation.

The group demonstrated for the first time ever that modifying the substrate surface using a coupling agent enables a strong covalent bond to be formed between an epoxy monolith material, which acts as an adhesion layer, and an adherend such as glass and metal, and this, in synergy with the anchor effect acting between the resin and the monolith, can achieve bonding of dissimilar materials with high adhesive strength and reliability.

This research was published in the online version of Langmuir, a surface chemistry professional journal, on September 13, 2020, and it was used on the cover of Vol. 36, No. 37 of the journal.

Paper

Title

Interfacial Structure Control and Three-Dimensional X-ray Imaging of an Epoxy Monolith Bonding System with Surface Modification

Contribution to the SDGs

sdgs9,12

9: Industry, innovation and infrastructure
12: Responsible consumption & production

Contact:

Graduate School of Engineering, Osaka Prefecture University
Prof. Akikazu Matsumoto

E-mail matsumoto[at]chem.osakafu-u.ac.jp *Please change [at] to @.